Thermo-electric Modules

Film Miniature Thermo-electric Modules

Thinner and lighter than conventional miniature Thermo-electric Modules

Features

This product has been developed specifically to improve your design flexibility.
Copper heat sinks can be soldered directly on the substrate.
* Only available on request

Substrate Specification

  • A：Standard surface ceramic substrate product,
    Module thickness tolerance ±0.15mm
  • C：Heat absorption side surface metallized substrate,
    Module thickness tolerance ±0.15mm
  • H：Heat dissipation side surface metallized substrate,
    Module thickness tolerance ±0.15mm
  • M：Heat absorption side/heat dissipation side surface metallized substrate,
    Module thickness tolerance ±0.15mm

*C, H and M types have different thickness methods.

Shape 1

Shape 2